Connector Housings: Selecting Wire to Board and Wire to Wire Types

Housings (Wire To Board / Wire To Wire) Technical Article

Housings play a critical role in electronic connectors. They not only affect the reliability, ease of installation, and electrical performance of the connectors but also determine the overall system durability and safety. Depending on their application, housings can be divided into Wire to Board and Wire to Wire categories. Wire to Board housings connect wires directly to a PCB, while Wire to Wire housings enable connections between wires, extending or branching signal and power transmission.

Structure and Features of Wire To Board Housings

The core design of Wire to Board housings is to ensure a secure connection between the wire and the PCB while considering high-frequency signal transmission, current-carrying capacity, and thermal performance. Typical structures include:

1.Contacts/Terminals: Usually made of phosphor bronze or brass, plated with tin or gold to enhance conductivity and corrosion resistance.

2.Housing Body: Commonly made of Nylon 66 or polyamide, which offers heat resistance and wear resistance.

3.Locking Mechanism: Ensures stability during insertion and removal, preventing loosening caused by vibration.

In industrial applications, the Molex KK 254 series is a classic example. Its 2.54mm pitch Wire to Board housings are widely used in household appliances, industrial controls, and communication devices. Compared to other models like JST XH series, Molex KK 254 offers more stable insertion force, high-temperature resistance, and manufacturing tolerance, although its size is slightly larger, suitable for PCBs with ample space.

Advantages of Wire to Board housings include:

Standardized pitch: Facilitates mass production and modular design

High compatibility: Can be used with various terminal types

High reliability: Maintains stable connections under mechanical vibration and temperature changes

Applications and Design of Wire To Wire Housings

Wire to Wire housings mainly focus on safe and reliable connections between wires. Although their structure is simpler, safety requirements are higher. Common designs include:

1.Terminal Chambers: The wire terminal is inserted and secured by a latch.

2.Multi-Pin Arrangement: Supports multiple wires simultaneously, increasing wiring density.

3.Sealing Mechanisms: Rubber gaskets or silicone plugs ensure IP65/IP67 protection against water and dust.

For example, Deutsch DT series Wire to Wire housings are widely used in automotive and construction machinery due to their waterproof and vibration-resistant features. Compared to TE Connectivity AMPSEAL series, DT series is more suitable for low-voltage control signals, while AMPSEAL focuses on high-current, high-density connections.

Key considerations in Wire to Wire housing design include:

Wire size compatibility: Thin wires may lead to poor contact; thick wires may be difficult to insert

Insertion cycles: Industrial applications typically require at least 50 insertions

Environmental adaptability: Temperature, humidity, and chemical exposure affect lifespan

Material Selection and Performance Comparison

Material choice is a critical factor in housing performance. Commonly used materials include Nylon 66, polyamide (PA), polycarbonate (PC). For high-temperature or high-protection applications, PBT (polybutylene terephthalate) and LCP (liquid crystal polymer) are used. Key performance comparisons are as follows:

For instance, JST VH series housings use high-heat nylon, suitable for automotive control modules, while Molex Micro-Fit 3.0 series uses PBT, capable of withstanding 105℃ environments while maintaining stable signal transmission. Material selection allows housings to be optimized for reliability and lifespan across various applications.

Classic Model Comparison and Selection Strategy

In practical engineering, choosing housings requires attention not only to type but also to rated current, voltage, insertion force, and environmental adaptability. Below is a comparison of typical Wire to Board and Wire to Wire housings:

1.Wire to Board

Molex KK 254: 2.54mm pitch, moderate insertion force, widely used in industrial control

JST XH series: 2.5mm pitch, suitable for compact electronic devices, lighter insertion force

TE Connectivity MTA series: Used for high-density PCB applications, supports rapid terminal insertion

2.Wire to Wire

Deutsch DT series: Waterproof, vibration-resistant, ideal for automotive and construction machinery

AMPSEAL series: High-density, multi-pin, suitable for high-current applications

JST SM series: Lightweight, low-current connection for household and consumer electronics

Selection strategy should prioritize electrical performance → mechanical performance → environmental adaptability → cost and availability. For example, in high-temperature automotive electronics, PA or PBT Wire to Wire housings are more reliable than Nylon 66. In consumer electronics, compact and lightweight JST Wire to Board housings are cost-effective.

Integration with Other types of Connectors

Housings rarely exist alone; they are often used with terminals, wires, and PCB headers, forming a complete connection system. Wire to Board housings can be paired with IDC (Insulation Displacement Connectors) to simplify PCB assembly, while Wire to Wire housings can be combined with sealed terminals for enhanced waterproof and dustproof performance.

In multi-connector systems, housing compatibility and interchangeability directly affect maintenance and upgrades. Modular design reduces inventory pressure while ensuring compatibility among different connector models. For instance, in automotive wiring harnesses, a single set of Wire to Wire housings can accommodate terminals from multiple manufacturers, reducing supply chain risk.

Future Trends and Innovations

Housings technology continues to evolve, with key trends including:

1.High-temperature and high-frequency materials: LCP, PEEK, and other advanced materials for high-frequency communication and power electronics.

2.Miniaturization: With the trend toward compact electronics, housings are becoming smaller while maintaining insertion force and reliability.

3.Modular and standardized design: Unified pitch and interface standards improve cross-system compatibility.

4.Intelligent and error-proof design: Features like dual-color plastics, misalignment prevention, and polarity markings reduce assembly errors.

For example, TE Connectivity Micro-MaTch series is applied in high-frequency, miniaturized modules, featuring compact structure, high-speed signal compatibility, and 105℃ temperature resistance, representing the future direction of Wire to Board housings.

In summary, housings—whether Wire to Board or Wire to Wire—play a central role in ensuring electrical performance, mechanical stability, and environmental adaptability. By optimizing materials, innovating structures, and carefully selecting models, engineers can achieve highly reliable, compatible, and long-lasting connection systems. Combining classic model comparisons and application experience allows rapid selection in practical projects, enhancing design efficiency and reducing maintenance costs. As electronic products become smaller, faster, and smarter, housing technology will continue to innovate, forming a more comprehensive connector ecosystem.