What is the difference between SMD and NSMD in PCB pad design?

Proper PCB pad design is critical to effectively soldering components to the board. For exposed pad packages, there are two standard soldering methods - SMD (SolderMask Defined) and NSMD (Non-Solder Mask Defined), each with its characteristics and advantages.

1. SMD

SMD refers to a padding process in which the solder mask opening is smaller than the metal pad. This process reduces the likelihood of pad detachment during soldering or desoldering. However, a disadvantage is that the method reduces the copper surface area available for solder joint connections and reduces the space between adjacent pads. This limits the thickness of the traces between the pads and may affect the use of the vias.

2. NSMD

NSMD refers to the padding process in which the solder mask opening is larger than the pad. This process provides a larger surface area for solder joint connections. It provides more enormous gaps between pads (compared to SMD), allowing for broader trace widths and more through-hole flexibility. However, during the soldering and desoldering process, the NSMD is more likely to fall off. Even so, NSMD still has better soldering performance and is suitable for solder joint package pads.

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