TE Connectivity launches OSFP connector and cable assembly

High density solutions support 400G data rate and provide excellent signal integrity and thermal performance.

TE Connectivity (TE), the world's leading connector and sensor company, today announced the launch of a new eight-channel small-size pluggable (OSFP) connector and cable component portfolio that supports data transfer rates of 200 Gbps and 400 Gbps to meet the needs of the next generation of data centers. The new OSFP connectors and cable components are designed to support the 8x28G NRZ and 8x56G PAM-4 protocols, and can also be used in the 8x112G PAM-4 protocol after future system upgrades.

TE's OSFP connector uses innovative microQSFP radiator technology to provide excellent heat dissipation and signal integrity required to support 400 Gbps data rates. In addition, TE's OSFP products can configure up to 36 400G ports in a 1RU switch to meet the next generation switch silicon product roadmap.

Zach Galbraith, product manager for TE Connectivity, said: "400 Gbps Ethernet is the next big upgrade in network speed. Systems designers need high-density solutions with superior signal integrity and heat dissipation. TE's new OSFP solutions can meet the performance requirements of designers, thus building a design that meets the requirements of the next generation of data center systems.

Christophe Metivier, vice president of Arista Networks Manufacturing and Platform Engineering, said: "We very much welcome the addition of TE's OSFP connectors and cable components to the expanding OSFP ecosystem. TE's products can provide the required signal integrity and heat dissipation performance for the development of a comprehensive 400 Gbps interconnection solution.

TE's extensive OSFP portfolio includes surface mounted connectors, 1x1 and 1x4 cages, and a variety of configurations, lengths and gauges for direct and branch passive copper cable assemblies.

For more information about TE Connectivity AMP Connectors, please keep your attention.