Product Overview

Part Number
40-6551-18
Quantity Available
10,000
Manufacturer
Aries Electronics, Inc.
Catalog
Sockets for ICs, Transistors
Description
CONN IC DIP SOCKET ZIF 40POS

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Documents & Media

Datasheets
40-6551-18

Product Attributes

Contact Finish - Mating :
Nickel Boron
Contact Finish - Post :
Nickel Boron
Contact Finish Thickness - Mating :
50.0µin (1.27µm)
Contact Finish Thickness - Post :
50.0µin (1.27µm)
Contact Material - Mating :
Beryllium Nickel
Contact Material - Post :
Beryllium Nickel
Dielectric Material :
Polyetheretherketone (PEEK), Glass Filled
Features :
Closed Frame
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
40 (2 x 20)
Operating Temperature :
-55°C ~ 250°C
Packaging :
Bulk
Part Status :
Active
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Series :
55
Termination :
Solder
Type :
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

Description

Certifications

BOM / PCB/ SMT

Our Benefits

ONE STOP SERVICE
BOM + PCB + SMT/DIP
LOW MOQ
Benefit from the lowest MOQ of 1 PCS that makes your business more flexible.
COMPETITIVE PRICE
Best prices from the original factory to improve your profit margin. 3% off for your first order.
AFTER-SALES SERVICE
400-days warranty. All defective products could be returned and replaced freely as soon as possible.
IN-TIME DELIVERY
Normal orders would be sent within 4 hours after you send the PO.

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