Product Overview

Part Number
SIP1X30-041BLF
Quantity Available
10,000
Manufacturer
Amphenol Commercial (Amphenol ICC)
Catalog
Sockets for ICs, Transistors
Description
CONN SOCKET SIP 30POS GOLD

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Documents & Media

Datasheets
SIP1X30-041BLF

Product Attributes

Contact Finish - Mating :
Gold
Contact Finish - Post :
Tin
Contact Finish Thickness - Mating :
30.0µin (0.76µm)
Contact Finish Thickness - Post :
200.0µin (5.08µm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Brass
Dielectric Material :
Polyphenylene Sulfide (PPS), Glass Filled
Features :
Closed Frame
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
30 (1 x 30)
Operating Temperature :
-
Packaging :
Bulk
Part Status :
Obsolete
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Series :
SIP1x
Termination :
Solder
Type :
SIP

Description

Certifications

BOM / PCB/ SMT

Our Benefits

ONE STOP SERVICE
BOM + PCB + SMT/DIP
LOW MOQ
Benefit from the lowest MOQ of 1 PCS that makes your business more flexible.
COMPETITIVE PRICE
Best prices from the original factory to improve your profit margin. 3% off for your first order.
AFTER-SALES SERVICE
400-days warranty. All defective products could be returned and replaced freely as soon as possible.
IN-TIME DELIVERY
Normal orders would be sent within 4 hours after you send the PO.

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