Product Overview

Part Number
BMI-C-007-01
Quantity Available
10,000
Manufacturer
Laird
Catalog
RFI and EMI - Contacts, Fingerstock and Gaskets
Description
CONTACT BECU 3.3X1.0MM

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Documents & Media

Datasheets
BMI-C-007-01

Product Attributes

Attachment Method :
Solder
Height :
0.126" (3.20mm)
Length :
0.130" (3.30mm)
Material :
Beryllium Copper
Operating Temperature :
-
Part Status :
Active
Plating :
Tin
Plating - Thickness :
-
Series :
BMI-C
Shape :
-
Type :
Shield Finger
Width :
0.059" (1.50mm)

Description

Certifications

BOM / PCB/ SMT

Our Benefits

ONE STOP SERVICE
BOM + PCB + SMT/DIP
LOW MOQ
Benefit from the lowest MOQ of 1 PCS that makes your business more flexible.
COMPETITIVE PRICE
Best prices from the original factory to improve your profit margin. 3% off for your first order.
AFTER-SALES SERVICE
400-days warranty. All defective products could be returned and replaced freely as soon as possible.
IN-TIME DELIVERY
Normal orders would be sent within 4 hours after you send the PO.

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