Product Overview

Part Number
XCZU9EG-1FFVB1156I
Quantity Available
10,000
Manufacturer
Xilinx
Catalog
Embedded - System On Chip (SoC)
Description
IC FPGA 328 I/O 1156FCBGA

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Documents & Media

Datasheets
XCZU9EG-1FFVB1156I

Product Attributes

Architecture :
MCU, FPGA
Connectivity :
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Core Processor :
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size :
-
Operating Temperature :
-40°C ~ 100°C (TJ)
Package / Case :
1156-BBGA, FCBGA
Packaging :
Tray
Part Status :
Active
Peripherals :
DMA, WDT
Primary Attributes :
Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
RAM Size :
256Kb
Series :
Zynq® UltraScale+™ MPSoC EG
Speed :
500MHz, 600MHz, 1.2GHz
Supplier Device Package :
1156-FCBGA (35x35)

Description

High-Performance FPGA Solutions from Xilinx: In-Depth Analysis of XCZU9EG and XC7K160T

In today’s rapidly evolving landscape of digitalization and intelligent systems, Field Programmable Gate Arrays (FPGAs) have emerged as a cornerstone technology, offering unparalleled flexibility and high-performance parallel processing capabilities. As one of the world’s leading integrated circuit manufacturers, Xilinx continues to be at the forefront of innovation, delivering industry-leading FPGA solutions widely adopted across sectors such as telecommunications, industrial automation, AI, automotive, and aerospace.

Among its vast portfolio, the Zynq UltraScale+ MPSoC series and Kintex-7 series have garnered significant attention. In particular, the XCZU9EG-1FFVB1156I and XC7K160T-1FBG676I stand out as flagship models, offering robust performance and scalable architectures. This article provides a detailed comparison of these two models, explores their technical highlights, and discusses their market relevance—especially in the fast-growing China electronic components and china electronic parts sectors.

XCZU9EG-1FFVB1156I VS XC7K160T-1FBG676I

XCZU9EG-1FFVB1156I — A Flagship in Heterogeneous MPSoC Architecture

The XCZU9EG-1FFVB1156I, from the Zynq UltraScale+ MPSoC family, exemplifies a new generation of FPGAs that tightly integrate processing systems with programmable logic. This device is engineered for compute-intensive, real-time embedded applications and enables seamless hardware/software co-design.

Key Features:

Heterogeneous Processing System: Equipped with a quad-core ARM Cortex-A53, dual-core Cortex-R5, and a Mali-400 GPU, it supports a wide range of workloads from embedded Linux applications to real-time control.

Massive Logic Resources: With over 600K system logic cells, it efficiently handles AI acceleration, image processing, and high-throughput computations.

High-Speed Interfaces: Supports PCIe Gen3, USB 3.0, SATA, Gigabit Ethernet, and DisplayPort, making it ideal for edge computing and high-speed data communication.

Industrial-Grade Design: With an FFVB1156 package and a temperature range of -40°C to +100°C, it is robust enough for mission-critical applications.

Target Applications:This device is widely used in autonomous driving systems, industrial robotics, 5G base stations, UAV control platforms, and advanced medical imaging systems—making it a high-value component in the china electronic parts market.

XC7K160T-1FBG676I — A Cost-Effective Workhorse in Mid-Range FPGA Design

The XC7K160T-1FBG676I, from the Kintex-7 family, represents Xilinx’s commitment to delivering high-performance FPGAs with a focus on power efficiency and cost-effectiveness. It’s a go-to choice for medium-complexity systems that require reliable processing at a competitive price point.

Key Features:

Balanced Logic Density: With 162K logic cells, it supports advanced control logic, signal processing, and data flow management.

High-Speed Serial Connectivity: Integrated GTX transceivers provide up to 12.5 Gbps speeds, supporting PCIe Gen2, Serial RapidIO, and 10G Ethernet applications.

Optimized for Power Efficiency: Built on a 28nm HPL process, it achieves a strong balance of power and performance for industrial environments.

Compact Package (FBG676): Allows for efficient PCB integration in space-constrained applications.

Target Applications:Ideal for video processing systems, industrial control platforms, aerospace instrumentation, and DSP acceleration. The XC7K160T is a popular choice among china electronic components distributors for its blend of performance and versatility.

Side-by-Side Technical Comparison


FeatureXCZU9EG-1FFVB1156IXC7K160T-1FBG676I
FamilyZynq UltraScale+ MPSoCKintex-7 FPGA
Process Technology16nm FinFET+28nm HPL
Integrated ProcessorARM Cortex-A53 ×4 + Cortex-R5 ×2 + GPUNone
Logic Resources>600K162K
Memory InterfaceSupports DDR4/LPDDR4Supports DDR3
High-Speed IOPCIe Gen3, USB 3.0, SATA, DisplayPortPCIe Gen2, GTX transceivers
Package & TemperatureFFVB1156, Industrial-gradeFBG676, Industrial-grade
Application SectorsAI, Automotive, Medical, TelecomIndustrial, Video, Communications


Strategic Importance in the Chinese Electronics Market

As China accelerates its drive toward “intelligent manufacturing” and “new infrastructure” initiatives, demand for high-performance and customizable silicon solutions is surging. Companies across sectors are increasingly sourcing advanced FPGAs to enable edge computing, smart vision, and secure communications. Devices like XCZU9EG and XC7K160T have become key assets in this transformation, widely adopted by leading OEMs, ODMs, and research institutions.

Moreover, with the rising sophistication of china electronic components supply chains, high-end FPGA devices are playing a critical role in enabling local innovation and reducing time-to-market for complex embedded systems.

At Asourcing Electronics Limited, we specialize in delivering world-class FPGA components through a highly responsive, technically proficient supply network. From product selection and technical consultation to fast delivery and volume procurement, we offer end-to-end support tailored to meet the dynamic needs of our clients.

Conclusion

Both the XCZU9EG and XC7K160T represent the best of Xilinx’s technological innovation in their respective segments. Whether your project demands a high-end heterogeneous platform or a power-efficient, mid-range FPGA, these two devices provide proven solutions that drive performance, scalability, and reliability.

For organizations seeking dependable china electronic parts sourcing or looking to stay ahead of emerging technologies in the global integrated circuit manufacturers landscape, Asourcing Electronics Limited is your trusted partner.

Contact us today to learn more about our solutions or to request a customized FPGA quotation. We are here to power your innovation—every step of the way.


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BOM / PCB/ SMT

Our Benefits

ONE STOP SERVICE
BOM + PCB + SMT/DIP
LOW MOQ
Benefit from the lowest MOQ of 1 PCS that makes your business more flexible.
COMPETITIVE PRICE
Best prices from the original factory to improve your profit margin. 3% off for your first order.
AFTER-SALES SERVICE
400-days warranty. All defective products could be returned and replaced freely as soon as possible.
IN-TIME DELIVERY
Normal orders would be sent within 4 hours after you send the PO.

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